giovedì 12 giugno 2014

LED lighting comparison

LED lighting comparison

MCOB LED comparison COB LED comparison High power LED comparison SMD LED comparison T-type LED comparison
Single Layer Aluminum Plate Big LED Chip on 3 Layers Plate High Power Chip on 3 Layers Small LED Chip on LED Pin On PC Board

100 lm/w - 140 lm/w

70 lm/w - 90 lm/w

60 lm/w - 80 lm/w

70 lm/w - 90 lm/w

60 lm/w 70 lm/w

Silicone Chips are applied directly on the aluminum plate allowing for up 97% heat dispersion

with IC-tpye Power Supply

Larger silicone Chips are welded the same way as on the 2nd generation surface mounted device, with 50% heat dispersion.

with 2or4 pins welded on single-sided PCB. Patent of LumiLED for multi-angle emission by optical lens .

Most of high power chips are called "Copy LumiLED"

Silicone Chips are welded on to a 3layers aluminum plate resulting in higher cost with only 50% heat dispersion.

Lighting Structure is made up of many pins on a PC board to achieve good lighting effect but with poor heat dispersion from multiple pin.

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